this is information on a product in full production. may 2013 docid7128 rev 4 1/9 STPS3L40 power schottky rectifier datasheet - production data features ? negligible switching losses ? low thermal resistance ? low forward voltage drop ? avalanche capability specified description schottky rectifier suited for switched mode power supplies and high frequency dc to dc converters. packaged in smc, and smbflat, this device is intended fo r use in dc/dc chargers. k a k a smc STPS3L40s smbflat STPS3L40uf table 1. device summary i f(av) 3 a v rrm 40 v t j (max) 150 c v f (max) 0.44 v www.st.com
characteristics STPS3L40 2/9 docid7128 rev 4 1 characteristics to evaluate the conduction loss es use the following equation: p = 0.30 x i f(av) + 0.047 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f(av) average forward current smc t l = 120 c ? = 0.5 3a smbflat t l = 130 c ? = 0.5 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a p arm repetitive peak avalanche power t p = 1 s tj = 25 c 1300 w t stg storage temperature range -65 to + 175 c t j operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 150 c table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead smc 18 c/w smbflat 10 table 4. static electrical characteristics symbol parameter test conditions typ. max. unit i r (1) 1. pulse test: t p = 380 s, ? < 2% reverse leakage current t j = 25 c v r = v rrm 100 a t j = 125 c 16 40 ma v f (1) forward voltage drop t j = 25 c i f = 3 a 0.5 v t j = 125 c 0.40 0.44 t j = 25 c i f = 6 a 0.62 t j = 125 c 0.52 0.58 dptot dtj --------------- 1 rth j a ? ?? ------------------------- - ?
docid7128 rev 4 3/9 STPS3L40 characteristics 9 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( ? = 0.5) - smc 0.0 0.4 0.8 1.2 1.6 2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 p (w) f(av) t =tp/t tp i (a) f(av) = 1 = 0.05 = 0.1 = 0.2 = 0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 i (a) f(av) t (c) amb r =75c/w th(j-a) r=r th(j-a) th(j-l) smc t =tp/t tp figure 3. average forward current versus ambient temperature ( ? = 0.5) smbflat figure 4. non repetitive surge peak forward current versus overload duration (maximum values) smc 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 i (a) f(av) smb flat t (c) amb r =75c/w th(j-a) r=r th(j-a) th(j-l) t =tp/t tp 0 2 4 6 8 10 12 14 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 i (a) m t(s) t =25c a t =75c a t =125c a smc figure 5. non repetitive surge peak forward current versus overload duration (maximum values) smbflat figure 6. normalized avalanche power derating versus pulse duration 0 5 10 15 20 25 30 35 40 45 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m t =25c l t =75c l t =125c l smb flat (non exposed pad) i m t =0.5 t(s) 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm
characteristics STPS3L40 4/9 docid7128 rev 4 figure 7. normalized avalanche power derating versus junction temperature figure 8. relative variation of thermal impedance junction to ambient versus pulse duration - smc 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25c) arm arm 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-c) th(j-c) t =tp/t tp t (s) p single pulse smc figure 9. relative variation of thermal impedance junction to lead versus pulse duration - smbflat figure 10. reverse leakage current versus reverse voltage applied (typical values) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 z/r th(j-l) th(j-l) smb flat t (s) p single pulse 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 i (ma) r v (v) r t =125c j t =100c j t =25c j figure 11. junction capacitance versus reverse voltage applied (typical values) figure 12. forward voltage drop versus forward current 10 100 1000 1 10 100 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j i (a) fm 0.01 0.10 1.00 10.00 100.00 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t j =25c (maximum values) t j =125 c (typical values) t j =125 c (typical values) t j =125 c (maximum values) t j =125 c (maximum values) v (v) fm
docid7128 rev 4 5/9 STPS3L40 characteristics 9 figure 13. thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board fr4, copper thickness = 35m) 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s (cm2) cu smb flat smc r (c/w) th(j-a)
package information STPS3L40 6/9 docid7128 rev 4 2 package information ? epoxy meets ul94,v0 ? lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 14. smc footprint dimensions in mm (inches) table 5. smc package dimensions ref dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.40 0.006 0.016 d 5.55 6.25 0.218 0.246 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 l 0.75 1.40 0.030 0.063 e c l e2 e1 d a1 a2 b 8.19 1.54 5.11 1.54 (0.061) (0.201) (0.322) (0.124) (0.061) 3.14
docid7128 rev 4 7/9 STPS3L40 package information 9 figure 15. smbflat footprint (dimensions in mm) table 6. smbflat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b (1) 1. applies to plated leads 1.95 2.20 0.077 0.087 c (1) 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.189 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 d a l l l1 l2 e e1 b c 1.20 1.20 3.44 5.84 2.07
ordering information STPS3L40 8/9 docid7128 rev 4 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode STPS3L40s s3l4 smc 0.24 g 2500 tape and reel STPS3L40uf fs3l4 smbflat 0.05 g 5000 tape and reel table 8. document revision history date revision description of changes jul-2003 2a last update. 08-feb-2007 3 reformatted to current standard. added ecopack statement. added smbflat package. 20-may-2013 4 updated smc package information. updated ecopack statement. corrected y axis labels of figure 12 .
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